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A Successful Conclusion | Highlights from Borun Microelectronics’ SEMICON 2026 Shanghai Exhibition

2026-03-31


Recently, SEMICON 2026 Shanghai International Semiconductor Exhibition successfully concluded in Shanghai. As a seasoned player in the field of precision semiconductor manufacturing, Borun Microelectronics brought Core Products and Technical Solutions Made a remarkable debut, leveraging professional expertise to build bridges of communication and garnering widespread attention and recognition across the industry.

During this exhibition, Borun Microelectronics Focusing on the core needs of domesticating semiconductor equipment, with a key exhibition showcasing Electron Beam Optics Column Ultra-precision motion platform Exposure chamber and Chuck tray The assembly of ultra-precision components and modules fully demonstrates the company’s technological prowess and innovative achievements in the field of precision manufacturing.

The exhibition drew semiconductor equipment manufacturers, research institutions, and industry professionals across the global value chain, who engaged in in-depth discussions on topics such as technology application, product compatibility, and project collaboration. As a result, numerous letters of intent and consensus were reached, effectively expanding channels for industry cooperation and strengthening market positioning.  

This exhibition represents both a crucial opportunity for Borun Microelectronics to showcase its core competencies and forge strategic industry partnerships, as well as a vital window for gaining insights into semiconductor industry trends and defining future R&D priorities. Moving forward, Borun Microelectronics will continue to deepen its expertise in ultra-precision manufacturing, accelerate independent innovation in cutting-edge technologies and the localization of critical components, and relentlessly enhance product performance while upgrading its solutions and service capabilities. By leveraging robust, technology-driven innovations, the company will strengthen the industry’s foundational infrastructure, support the semiconductor value chain’s drive toward self-reliance and high-quality development, and continuously inject new momentum into the global transformation toward intelligent semiconductor manufacturing.

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