Company Introduction
Hunan Borun Microelectronics Semiconductor Technology Co., Ltd.
Hunan Borun Microelectronics Semiconductor Technology Co., Ltd. was established in 2022, located in the hometown of Lei Feng—Changsha Wangcheng Economic Development Zone. The company specializes in the research and development, production, and sales of semiconductor equipment structural component integration. It covers the processing and integrated assembly of ultra-precision parts (sub-micron level), vacuum chambers, gas pipeline integration, and high-end packaging molds.
The first phase of the company's total investment is 30 million yuan, with more than 100 sets of various precision processing and testing equipment, welding production lines, high-clean assembly workshops, and cleaning production lines. The company has an elite team of over 100 people, including 3 with master's degrees, 10 with bachelor's degrees, and 1 national-level welding master consultant. More than half of the staff have over 10 years of industry work experience.
Recently, the company has emerged in the field of semiconductor equipment components, becoming a key supplier for some semiconductor equipment companies in Central South, South China, and Eastern regions. With the original intention of "Chinese Chip Dream," all employees of the company will work together to be responsible for the quality of each component. They aim to contribute their modest efforts to promote the localization process of semiconductor equipment and improve the domestic supply chain of semiconductor equipment components.
The company was established in
The total investment of the first phase of the company is 30 million yuan.
With all kinds of precision processing and testing equipment
The company has an elite team
Borun Team
Professor at Xi'an Jiaotong University, doctoral supervisor. Conducted visiting research in the research team of Professor Wang Zhonglin at Georgia Institute of Technology from 2009 to 2010. Currently serves as the Vice Chairman of the Xi'an Nanotechnology Society, a member of the Electronic Society's Field Emission Committee, a senior member of the China Micro-Nano Technology Association, and an IEEE member.
A welding master who enjoys special allowances from the State Council. Possesses rich practical experience in precision welding of major national key equipment.
Borun Team
Professor at Xi'an Jiaotong University, doctoral supervisor. Conducted visiting research in the research team of Professor Wang Zhonglin at Georgia Institute of Technology from 2009 to 2010. Currently serves as the Vice Chairman of the Xi'an Nanotechnology Society, a member of the Electronic Society's Field Emission Committee, a senior member of the China Micro-Nano Technology Association, and an IEEE member.
A welding master who enjoys special allowances from the State Council. Possesses rich practical experience in precision welding of major national key equipment.
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Monday to Friday 09:00~18:00
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268 Chigang Road, Economic Development Zone, Wangcheng District, Changsha City, Hunan Province
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