OUR PRODUCTS
Specializing in the research and development, production and sales of semiconductor equipment structural parts combination integration
About Borun
Hunan Borun Microelectronics Semiconductor Technology Co., Ltd. was established in 2022 and is located in Wangcheng Economic Development Zone, Changsha, the hometown of Lei Feng. The company specializes in the research and development, production and sales of semiconductor equipment structural parts combination integration. Covers ultra-precision parts (sub-micron) processing and integrated assembly, vacuum chamber and gas pipeline integration and high-end packaging mold.
Borun Microelectronics focuses on the R & D and manufacturing technology team of ultra-precision semiconductor core components, with core members mainly from Central South University and elite talents in the industry.
At present, a total of 5 utility models and 1 invention patent (authorized) have been obtained, and 10 are under review.
It has more than 100 sets of various precision processing and testing equipment, welding production lines, high-clean assembly workshops and cleaning production lines.
Covers ultra-precision parts (sub-micron) processing and integrated assembly, vacuum chamber and gas pipeline integration and high-end packaging mold, etc.
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Partners
The company has emerged in the field of semiconductor equipment parts, and has become the main supporting supplier of semiconductor equipment enterprises in central and southern China and eastern China.
Market Services
Our company has a professional technical research and development team, which can provide customers with a series of professional services such as product consultation, technical support, product after-sales service, etc.
2026-03-31