Honor
Borun Microelectronics focuses on the R & D and manufacturing technology team of ultra-precision semiconductor core components. The core members are mainly from Central South University and elite talents in the industry. It has established multi-faceted and long-term cooperation with Central South University, Xi'an Jiaotong University and other universities and research institutes. Technical development cooperation of colleges and universities. In the process of promoting the localization of semiconductor components, our company also pays attention to the construction of intellectual property system. At present, a total of utility models have been obtained.6Item, invention patent1Item (Authorization), under review10Item.
National High-tech Enterprise
Excellent partner
Member Units of the Hunan Semiconductor Industry Association
A quantum chip packaging fixture - Invention Patent Certificate
A cooling device for the production of mold accessories - Utility Model Patent Certificate
A verticality inspection device for mold accessories - Utility Model Patent Certificate
A quick-release hot runner valve needle - utility model patent certificate
A locking device for processing precision mold accessories - Utility Model Patent Certificate
A convenient impeller core box mold - Utility Model Patent Certificate
A detachable adapter plate for hot runner systems - Utility Model Patent Certificate
Contact Us
Monday to Friday 09:00~18:00
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Address
268 Chigang Road, Economic Development Zone, Wangcheng District, Changsha City, Hunan Province
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